- .001 Ohms Point to Point
- Lower Cost Tooling
- Faster Assembly ( less screws)
- Major weight & Cost savings over sheet metal.
Our Gridshield
tm plastic enclosures , or our New GridSF
tm Patent pending can provide major Weight and space savings, as well a meeting your cost goals. EMI shielded enclosures that will solve problems. We can provide prototype development to production programs. Our Molded in wire mesh systems have won the
Innovation of the year 2009 from the SPE - and are now being considered by the military for use to reduce equipment weight , but also to reduce the cost of shipping and transporting military equipment .
LOW TOOLING COST:
This part has a very low profle , which means the mold is shallow ( on both cavity and core) this means a much smaller mold with less machining required.
Features "In -Line of Draw " meaning molded in features that would normally require costly slides or lifters can be molded in without , saving thousands of tooling dollarts.
Example: This fold up creates a enclosure that is 5 "x 4 "x 6" , If this were molded as a box , with the no draft PCB guides the mold cost would be $30,000 - to $ 40,000.00 , plus you would require an additiional lid or cover.
Fold-Up Mold is $15,000.00 , plus you can add mounting features to all of the surfaces without the penalty of slides or lifters.